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AUO unveils round OLED and foldable OLED for the smart watch in Touch Taiwan 2017

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AUO showed the OLED that can be collapsible and three kinds of round OLEDs (1.2-inch, 1.3-inch, 1.4-inch) for the smart watch in Touch Taiwan 2017 held on 20th.

The round OLEDs in 1.2-inch and 1.4-inch of AUO are 326ppi, and it lowers an electric consumption at 30% versus former production goods. AUO also improves the visibility capacity in outdoor by embedding the brightness increase mode to make a display screen of two kinds of round OLEDs be clear even under bright sunlight.

The 1.3-inch OLED aimed at the smart watch for kids is light in weight, and strengthens the usability with a power saving mode and an intuitive touch interface function.

AUO displays two types of 5-inch flexible OLEDs that can be rolled or folded. Such two types of 5-inch flexible OLEDs apply the plastic board and AUO self-developed structure (special structural layer).

<AUO, 5 inch foldable OLED touch panel>

The 5-inch foldable OLED combines a flexible touch screen sensor that is developed by AUO itself.  The company said “it would provide excellent image quality, even if the curvature radius of the folded part is 4mm and less”.

For 5-inch rollable OLED, they explained “The thickness of the panel is just 0.1mm and only 5g. This model with the rolling radius of 4mm will provide wide color gamut”.

In last SID 2017, AUO has announced about that they applied the structure locating the TFT (Thin Film Transistor) and TFE (Thin Film Encapsulation) at the neutral axis to stand the compression stress or tensions during being folded.

OLED Encapsulation, TFE is the Top Trend

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  • Expected application of TFE to all edge type and full screen use flexible OLED
  • PECVD manufacturing equipment, 62% of total encapsulation manufacturing equipment market

According to 2017 OLED Encapsulation Annual Report published by UBI Research, of OLED encapsulation technology, TFE (thin film encapsulation) will be applied to approximately 70% of total OLED panel in 2021, and become the key encapsulation technology.

OLED display trend is heading toward minimizing bezel for full screen actualization from edge type, and flexible OLED is being considered as the most optimal display for full screen. As such, Chinese panel companies, as well as Samsung Display and LG Display, are concentrating on flexible OLED mass production line investment rather than rigid.

Flexible OLED must be thin and bendable; glass using frit encapsulation Is not suitable and TFE (thin film encapsulation) or hybrid encapsulation must be applied. TFE is a structure that is formed via laminating thin inorganic and organic materials. In the early stages of development, it had 11 layers of complex organic and inorganic material deposition with low yield. However, it now has been reduced to 3 layers and greatly improved productivity, yield, and cost and it is being applied to most of flexible OLED.

<Thin film encapsulation development history, 2017 OLED Encapsulation Annual Report>

Hybrid encapsulation, which uses barrier film, is being applied to some flexible OLED. However, due to the high cost of barrier film and relatively thick thickness, recent investment is focused on TFE application.

According to UBI Research analyst Jang Hyunjun, TFE encapsulation is expected to continue to be applied to edge type and full screen type flexible OLED panel, and related manufacturing equipment and material market will carry on their growth.

The report explains that TFE’s key manufacturing equipment are inorganic material forming PECVD and organic material forming ink-jet printer. In particular, PECVD is used in inorganic material film formation of hybrid encapsulation as well as TFE. Therefore, PECVD market is estimated to record US$ 6,820 million in 2017-2021, and occupy approximately 62% of the total encapsulation manufacturing equipment market.

<PECVD manufacturing equipment market volume, 2017, 2017 OLED Encapsulation Annual Report>

The report includes encapsulation related key manufacturing equipment and material market in addition to encapsulation development history and trend, and key panel companies’ trend.