Innovation Center for Organic Electronics in Yamagata University in Japan discussed low cost flexible OLED encapsulation in Lighting Japan 2016 conference. Existing flexible OLED encapsulation mainly used hybrid encapsulation structure that forms multi-layer thin film passivation layers on top of OLED, and then applying adhesive organic material and laminating gas barrier film. The encapsulation structure presented by Yamagata University forms, of the hybrid encapsulation structure, thermoset resin and barrier film above OLED without multi-layer thin film passivation, and laminate at approximately 130 °C. Yamagata University announced that they were successful in transparent flexible OLED panel development on January 13 using encapsulation, and that this panel will be presented in Printable Electronics 2016 in Tokyo from January 27.
The OLED panel to be exhibited is a leaf shaped of 45 mm width, 110 mm length, weighs less than 1.2g, and 250 um thick transparent film substrate that can be folded.
According to Yamagata University, if the newly developed encapsulation is applied, the OLED lighting panel price can be reduced as passivation layer is not used. Also, Yamagata University revealed as it can satisfy both transparent and flexible categories simultaneously, it is estimated that it will become a key technology in future transparent flexible OLED lighting development.